What are the application cases of resin material welded and bent parts in semiconductor field?
The following are some application cases of resin materials welded and bent parts in the semiconductor field:
Fluid delivery system:
PFA welded joints: PFA (perfluoroalkoxy resin) welded joints are used in high-purity fluid delivery systems in semiconductor manufacturing. PFA material has ultra-high purity and extremely low metal ion content, which can completely eliminate the risk of metal pollution. Its excellent chemical inertness makes it show zero corrosion to typical semiconductor chemicals such as etching solution, cleaning agent and photoresist solvent. PFA welded joints with hot melt welding technology can form permanent seal, with extremely low leakage rate, improved pressure resistance and prolonged service life, and are widely used in DI water delivery pipeline, waste gas treatment pipeline of etching process equipment, process cavity connection, grinding fluid delivery, ultra-pure water washing and waste liquid discharge.
Chip package:
Resin package shell: For example, the IGBT package structure of Shenzhen Qi Fei Semiconductor Co., Ltd. adopts resin package shell. Through special design, the shell can realize internal pressure reduction and heat dissipation. The heat generated by the chip is transferred to the heat dissipation assembly through the heat conducting sheet and silicone grease, and then distributed to the outside of the resin package. At the same time, the air pressure generated by high temperature inside can be discharged to the outside through the release hole, thus avoiding a series of problems caused by high temperature inside the device.
Resin bonding materials such as ACF, ACP and NCP: In electrode welding of semiconductor elements and substrates, resin materials such as ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste) and NCP (Nonconductive Paste) are often used for bonding. These resin materials have low bonding temperature, which can shorten the production time and improve the packaging reliability.
Wafer manufacturing equipment components:
Wafer transport carrier: PEEK (polyether ether ketone) is usually used, which has the characteristics of high cleanliness and corrosion resistance of etching solution, and does not produce metal debris when rubbing, thus avoiding scratching the wafer. In the process of wafer transmission, the quality and accuracy of the wafer can be ensured.
Electrostatic protection tray: the conductive resin tray with carbon nanotubes added has a surface resistance of 10-10Ω, which can effectively discharge static electricity and prevent electrostatic discharge from damaging the wafer, and at the same time, it will not be short-circuited due to conduction, providing a safe storage and transportation environment for the wafer.
